au.\*:("OH, T. S")
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Adhesion of polyimides to ceramics : effects of aminopropyltriethoxysilane and temperature and humidity exposure on adhesionBUCHWALTER, L. P; OH, T. S; KIM, J et al.Journal of adhesion science and technology. 1991, Vol 5, Num 4, pp 333-343, issn 0169-4243, 11 p.Article
The Effects of Si Submounts Containing Cu Thermal Vias on the Heat-Dissipation Characteristics of a High-Power Light-Emitting Diode PackageKIM, M. Y; JEONG, T; HA, J. S et al.Journal of electronic materials. 2014, Vol 43, Num 2, pp 630-635, issn 0361-5235, 6 p.Article
Fabrication of multiwalled carbon nanotubes-reinforced Sn nanocomposites for lead-free solder by an electrodeposition processCHOIA, E. K; LEE, K. Y; OH, T. S et al.The Journal of physics and chemistry of solids. 2008, Vol 69, Num 5-6, pp 1403-1406, issn 0022-3697, 4 p.Conference Paper
Dielectric properties and microstructural behaviour of B-site calcium-doped barium titanate ceramicsPARK, J. G; OH, T. S; KIM, Y. H et al.Journal of materials science. 1992, Vol 27, Num 21, pp 5713-5719, issn 0022-2461Article
Hydrothermal stability of Cr/polyimide interfacesKIM, D. G; MOLIS, S. E; OH, T. S et al.Journal of adhesion science and technology. 1991, Vol 5, Num 7, pp 509-521, issn 0169-4243, 13 p.Article
Thermoelectric properties of the n-type 85% Bi2Te3-15% Bi2Se3 alloys doped with Sbl3 and CuBrHYUN, D. B; HWANG, J. S; YOU, B. C et al.Journal of materials science. 1998, Vol 33, Num 23, pp 5595-5600, issn 0022-2461Article
Toughening of cyanate ester resins with cyanated polysulfonesHWANG, J. W; PARK, S. D; CHO, K et al.Polymer (Guildford). 1997, Vol 38, Num 8, pp 1835-1843, issn 0032-3861Article
Cyclic fatigue-crack propagation along ceramic/metal interfacesCANNON, R. M; DALGLEISH, B. J; DAUSKARDT, R. H et al.Acta metallurgica et materialia. 1991, Vol 39, Num 9, pp 2145-2156, issn 0956-7151Article
Adhesion enhancement of Cr/polyimide interfaces using RF pre-sputtering of polyimide surfacesOH, T. S; KOWALCZYK, S. P; HUNT, D. J et al.Journal of adhesion science and technology. 1990, Vol 4, Num 2, pp 119-129, issn 0169-4243Article
Adhesion of polyimides to ceramic substrates : role of acid-base interactionsOH, T. S; BUCHWALTER, L. P; KIM, J et al.Journal of adhesion science and technology. 1990, Vol 4, Num 4, pp 303-317, issn 0169-4243Article
Ceramic/metal interfacial crack growth: toughening by controlled microcracks and interfacial geometriesOH, T. S; RÖDEL, J; CANNON, R. M et al.Acta metallurgica. 1988, Vol 36, Num 8, pp 2083-2093, issn 0001-6160Article
CO sensitivity of La2O3-doped SnO2 thick film gas sensorCHOI, J. Y; OH, T. S.Thin solid films. 2013, Vol 547, pp 230-234, issn 0040-6090, 5 p.Conference Paper
Electrodeposition and mechanical properties of Ni-carbon nanotube nanocomposite coatingsJEON, Y. S; BYUN, J. Y; OH, T. S et al.The Journal of physics and chemistry of solids. 2008, Vol 69, Num 5-6, pp 1391-1394, issn 0022-3697, 4 p.Conference Paper
Electrical properties of the Pt/Sr0.85Bi2.4Ta2O9/TiO2/Si structure with variation of the Sr0.85Bi2.4Ta2O9 film thicknessKIM, W; PARK, J. D; CHOI, J. H et al.Journal of materials science letters. 2003, Vol 22, Num 7, pp 535-537, issn 0261-8028, 3 p.Article
The crystalline quality of InxAl1-xAs layers on InP grown by molecular beam epitaxy at 520°CCHOI, J. S; OH, T. S; CHOO, W. K et al.Journal of materials science. 2000, Vol 35, Num 3, pp 655-660, issn 0022-2461Article
Thermoelectric properties of the p-type Bi2Te3-Sb2Te3-Sb2Se3 alloys fabricated by mechanical alloying and hot pressingKIM, H. C; OH, T. S; HYUN, D.-B et al.The Journal of physics and chemistry of solids. 2000, Vol 61, Num 5, pp 743-749, issn 0022-3697Article
A study on new DCT-based bit rate reduction algorithm and variable speed playback for a home-use digital VCRLEE, J. H; SEO, J. T; PARK, Y. C et al.IEEE transactions on consumer electronics. 1992, Vol 38, Num 3, pp 236-242, issn 0098-3063Article
